Ultrasonic Cleaning Lines for cleaning
wafers after cutting.
Ultratech, spol. s r.o. is producer of
ultrasonic cleaning tanks and lines for final cleaning wafers after wire saw
cutting processes. During last
several years our cleaning lines were
manufactured, delivered and put into operation at our customers’ plants in e.g.
The machines have modular construction which
allows us to set the machines as “tailor made” under customers’ requests.
Main technical parameters of standard cleaning
tanks for final cleaning wafers after cutting processes:
-
Inner tank dimensions: 660 x 400 x 390 (L x W x H) mm (Possible tank size under
customers’ request.)
-
Tank volume: 70 or
-
Acoustic power: 25W/l
Ultrasonic cleaners for final cleaning silicon wafers
after cutting:
Manually operated cleaners:
They
are suitable mainly for producers with lower production capacity.
Production
range is from one bath cleaners up to line with several
Possible accessories:
- Baskets
- The Hot air dryer S 105
- Waggling mechanism – for making waggling movement with baskets under
liquid level during cleaning cycle due to ensuring
exposition of whole wafers surface by US waves and better washing away
impurities
Various manually operated
cleaning tank and lines.
Automatically operated cleaners:
They are suitable for mass producers. Transport of baskets with wafers
between tanks is full automatic while loading and unloading baskets
out of the line remains manual. The lines have modular construction which
allows us to add or take away modules under customers’
requirement. Cleaning power: 1500 wafers / hour when cleaning cycle take
6 min.
Automatically
operated cleaning lines, type UC 14M 95A.
Possible accessories:
- Baskets
- The Hot air dryer S 201
- System for automatic working liquids replacement
- Storage tank for hot DI water preparation MZH 001
- Baskets:
The automatic cleaning lines are designed to clean wafers positioned
into special stainless steel baskets. One basket serves for positioning
of 6 pcs of standard plastic cassettes for wafers. One plastic cassette
is for 25 pcs of wafers. It means one basket is determined for
max. 150 pcs of wafers. Various shapes and sizes are delivered (Baskets
under customers’ requirement are possible too).
- The
Hot air dryer, S 201:
The
Hot air dryer S 201 is determined for built-in into automatic cleaning
lines and serves for drying wafers at set cycle time.
- System
for automatic working liquids replacement:
The system
serves for automatic draining used liquids from before chosen tank and for
automatic filling the tanks by hot DI water.
Cleaning
agents are added into the tank manually. The whole replacement is executed
during next cleaning cycle standing it means
the
cleaning line can work continuously without stop due working liquid
replacement.
- Storage
tank for hot DI water preparation, MZH 001:
The equipment MZH
001 is designated to prepare required volume of hot DI water for automatic
replacement of working liquids
into automatic US
cleaning lines for cleaning wafers after cutting processes. The device mainly
consists of one storage tank for
DI water equipped
by electric heating system with temperature control by means of thermostat, one
pump for pumping (mixing)
DI water inside the
tank and a switchboard.
Except of the
in wafers production area:
Spraying machines PC for precleaning wafers after
cutting processes:
Immediately
after wafers are cut their surface is heavily contaminated by residual slurry
layers which are usually consist of cutting medium
(usually
oil or polyethyleneglycol), Si dust, SiC abrasive….. For removing of the big
quantity of the impurities it means for preliminary
cleaning
is the best using of spraying cleaning method mainly if the cutting medium is
glycol or combination spraying and immersion
cleaning
methods. Type PC 1M 200A serves for ungluing wafers by their immersion into
acetic acid too.
PC 1M 130
PC 1M 200A
Ultrasonic cleaners for cleaning the silicon scrap
(raw material):
Ultrasonic cleaner, type UC 4M 50M is determined to clean the
silicon scrap (raw material) from impurities by means of ultrasonic
energy. The cleaning process
is under DI water or DI water solutions (with cleaning agent added). The
ultrasonic cleaning line consists
of two ultrasonic tanks, two
rinsing tanks, an automatic vertical transport system for automatic vertical
movements,
DI water regeneration station
of switchboard. The cleaning line is designated for cleaning the raw material
only
with special stainless steel
baskets.
UC
4M 50M Basket with scrap
Hot air dryers:
The dryers are designed for
drying wafers after cleaning. Two variant are produced by us:
- Independently standing
machines – type S 105, which are
determined mainly for manually operated US cleaning lines.
-
Built-in dryers – type S 201, which
are determined for automatically operated US cleaning lines.
The
dryers are determined for drying one basket with wafers it means 150 pcs of
wafers / 1 drying cycle.
S 105 S 201
Mixers:
The mixers types H serve for cutting slurry preparation.
Our firm produce mixers with tank volume 400, 500 a 2000l or under
customers
requirements. The mixers
can be equipped by various equipments usually under customers requirements –
e.g. pump, timer...
H 400
H 500
Spool cutting machines:
The
Spool cutting machines RD 001 are designed
for cutting used wire for spools of cutting machines for wire saw cutting.
Cutting
power is c. 18 spools / 8 hours.
RD
001
References:
JSC
PILLAR,
Silicio
Solar SAU,
PCMP
Podolsk,
Swiss Wafers, Weinfelden, Switzerland
KCMP,
Orlovka, Kyrgyz Republic
MBP mbH,
PTE,